Year in Review: 2023

Thousands of dedicated volunteers representing over 350 member companies helped JEDEC serve the industry in 2023, and contributed to a year filled with both new and ongoing initiatives.

Standards and Publications

JEDEC continues to develop important new industry standards and publications in the areas of memory, packaging, quality and reliability, thermal standardization, electronic sensitivity and electrical interface, wide bandgap, and more. In 2023, JEDEC published 10 complete standards, 6 publications, 2 joint standards and one joint reference document, 17 registration outlines, 4 memory device specifications, and one memory module design file registration.  An additional 48 standards and publications received updates. See a complete listing of standards and documents recently published by JEDEC.

Events & Meetings

JEDEC held a Mobile, IOT and Server Forum in in May 2023 in Seoul, Korea and Hsinchu, Taiwan. JEDEC also held two informational sessions at the Flash Memory Summit in August in Santa Clara, CA. In September, JEDEC held an Automotive Electronics Forum in San Jose, CA. In addition, 25 committee meetings were held during the year.


2023 saw an 11% increase in the number of member companies in mainland China, up from 62 companies in 2022 to the current 69 companies. This number accounts for 19% of the current total JEDEC membership. Continued growth in membership from mainland China is expected over the next five years due to China’s growing semiconductor industry, as well as increased awareness of participation in international standardization. JEDEC is in the process of engaging TC599, a newly established technical committee focused on semiconductor standardization in China, to harmonize standardization procedures of both organizations, and to help prevent fragmentation of standards for the global semiconductor industry.

Industry Collaboration

During the past year JEDEC maintained existing liaisons and developed new partnerships. Such collaboration is vital to the industry and helps avoid duplicative standards development efforts. Key activities in 2023 included:

  • AEC: AEC and JEDEC signed an MOU to facilitate joint standards development activities.
  • CXL: CXL and JEDEC have an MOU in place to facilitate the exchange of information, align future efforts, and reduce overlap between the two technologies.
  • CTA: JEDEC was an Allied Association for CES 2023.
  • DLA: JEDEC continued its collaboration with the Defense Logistics Agency (DLA). The triad of JEDEC/SAE/DLA brings together the perspectives of the manufacturers, suppliers and government to update pertinent military standards including MIL-STD-750, MIL-STD-883, MIL-PRF-19500, MIL-PRF-38534, and MIL-PRF-38535.
  • ECIA: JEDEC and ECIA are planning a joint task group effort to update J-STD-075.
  • ESDA: JEDEC and ESDA have several ongoing collaborative projects related to ESD, including recent updates to joint standards JS-001-2023 and JS-002-2022.
  • IEC: Introduced MOUs for requirements, tests and data schemas for harmonization/driving of JEDEC standards into IEC.
  • IPC: JEDEC and IPC continued their longstanding collaboration on standards for quality and reliability.
  • JEITA: JEDEC and JEITA held a virtual joint meeting September 2023 to continue their standards harmonization efforts.
  • MIPI® Alliance: JEDEC’s Universal Flash Storage standard aligns with industry–leading specifications from the MIPI Alliance to form its Interconnect Layer. This collaboration continued with UFS version 4.0, which references the MIPI M-PHY® v5.0 physical layer specification and the MIPI UniPro® v2.0 transport layer specification.  MIPI was also a sponsor of the September 6, 2023 Automotive Forum in San Jose, CA.
  • NIST: JC-13 continues to receive NIST participation and support for its IGA and Wirebond task groups.
  • OCP: A new alliance between the Open Compute Project Foundation (OCP) and JEDEC was formed to provide a mechanism to standardize Chiplet part descriptions leveraging OCP Chiplet Data Extensible Markup Language (CDXML) specification as part of JEDEC JEP30: Part Model Guidelines for use with today’s EDA tools.
  • SAE: JEDEC’s JC-13 Committee and SAE’s CE-11 and CE-12 Committees continued their longstanding collaboration on updating pertinent military standards.

For more information on JEDEC’s industry collaborations click here.