Year in Review: 2022

Thousands of dedicated volunteers representing over 350 member companies helped JEDEC serve the industry in 2022, and contributed to a year filled with both new and ongoing initiatives.

Standards and Publications

JEDEC continues to develop important new industry standards and publications in the areas of memory, packaging, quality and reliability, thermal standardization, electronic sensitivity and electrical interface. In 2022, JEDEC published 27 complete standards, 6 publications, updated 1 joint standard, 17 registration outlines, 2 Performance Standards, and 6 memory device specifications and Memory Module Design File Registrations, and revised 27 standards.  See a complete listing of standards and documents recently published by JEDEC.


With a return to in-person events, JEDEC’s annual ROCS Workshop was held May 9 in Monterey, CA.  JEDEC also held the following events in May in Santa Clara, CA:  Server/Cloud Computing/Edge Forum; Memory Tutorial; DDR5 Workshop.  JEDEC and JEITA held a joint Automotive Electronics Forum in Tokyo, Japan in November.


2022 saw a nearly 32% increase in the number of members companies in China, up from 47 companies in 2021 to the current 62 companies.  This accounts for 17.9% of the total JEDEC membership. Additional growth in membership from mainland China is expected to continue over the next five years due to China’s increasing investment in its semiconductor industry, growing demand for new semiconductor devices, as well as increased awareness of participation in international standardization. The recent clarification of the restrictions for companies on the Entity List of the U.S. Department of Commerce's Bureau of Industry and Security regarding participating in standardization activities is also a positive factor which will continue to drive future membership growth in this market.

Industry Collaboration

During the past year JEDEC maintained existing liaisons and developed new partnerships. Such collaboration is vital to the industry and helps avoid duplicative standards development efforts.  Key activities include:

  • ANSI: JC-13 and JC-14 leadership participated in the ANSI workshop on Global Supply Chain Security for Microelectronics in July.
  • CXL: CXL and JEDEC signed an MOU to form a joint Work Group to exchange information, align future efforts, and reduce overlap between the two technologies.
  • CTA: JEDEC was an Allied Association for CES 2022.
  • DLA: JEDEC continued its collaboration with the Defense Logistics Agency (DLA). The triad of JEDEC/SAE/DLA brings together the perspectives of the manufacturers, suppliers and government to update pertinent military standards including MIL-STD-750, MIL-STD-883, MIL-PRF-19500, MIL-PRF-38534, and MIL-PRF-38535.
  • ECIA:  JEDEC and ECIA are re-defining the next revision J-STD-002F Solderability for a 2021 joint task group effort.
  • ESDA: JEDEC and ESDA have several ongoing collaborative projects related to ESD.
  • IEC: Introduced MOUs for requirements, tests and data schemas for harmonization/driving of JEDEC standards into IEC.
  • IPC: JEDEC and IPC continued their longstanding collaboration on standards for quality and reliability, including: Pb-Free wave solder (ECIA/IPC), Acoustic Microscopy J-STD-035, and continued work on updates to J-STD-020.
  • JEITA: JEDEC and JEITA held a virtual joint meeting September 2022 to continue their standards harmonization efforts.
  • MIPI® Alliance: JEDEC’s Universal Flash Storage standard aligns with industry–leading specifications from the MIPI Alliance to form its Interconnect Layer. This collaboration continued with UFS version 4.0, which references the MIPI M-PHY® v5.0 physical layer specification and the MIPI UniPro® v2.0 transport layer specification.
  • NIST: JC-13's Chair provided a well-received JEDEC JC-13 overview to NIST in July and JC-13 is receiving NIST support for its IGA and Wirebond task groups. 
  • PCI-SIG: PCI-SIG and JEDEC have an MOU in place to facilitate work on the upcoming JEDEC Automotive SSD standard.
  • SAE: JEDEC’s JC-13 Committee and SAE’s CE-11 and CE-12 Committees continued their longstanding collaboration on updating pertinent military standards.