Global Standards for the Microelectronics Industry
Year in Review: 2021
Thousands of dedicated volunteers representing over 300 member companies helped JEDEC serve the industry in 2021, and contributed to a year filled with both new and ongoing initiatives.
Standards and Publications
JEDEC continues to develop important new industry standards and publications in the areas of memory, packaging, quality and reliability, thermal standardization, electronic sensitivity and electrical interface. In 2021, JEDEC published 32 complete standards, 9 publications, updated 1 joint standard, 9 registration outlines, 1 design guide/registration, and 8 memory device specifications and Memory Module Design File Registrations, including the following:
- JESD82-511: DDR5 Registering Clock Driver Definition (DDR5RCD01)
- JESD233: XFM Device
- JESD253: Enclosure Form Factor for SSD Devices
- PS-005A: DDR5 Pin U/R/LR DIMM Connector Performance Standard
- JEP182: Test Method for Continuous-Switching Evaluation of Gallium Nitride Power Conversion Devices
- JEP183: Guidelines for Measuring the Threshold Voltage (VT) of SiC MOSFETs, which is the first publication developed by JEDEC’s JC-70.2 silicon carbide subcommittee
- JEP184: Guideline for Evaluating Bias Temperature Instability Of Silicon Carbide Metal-Oxide-Semiconductor Devices For Power Electronic Conversion
- JESD304-4.01 DDR4 NVDIMM-P Bus Protocol
JEDEC also published the following notable standards updates:
- JESD250C: Graphics Double Data Rate 6 (GDDR6) SGRAM Standard
- JESD22-A110E: Highly Accelerated Temperature and Humidity Stress Test (HAST)
- JESD209-4D: Low Power Double Data Rate 4 (LPDDR4)
- JESD79-5A: DDR5 SDRAM
In addition, the JEDEC Board of Directors has undertaken a project to identify deprecated terminology in existing documents and to work with the technical committees to revise and republish these documents.
During the past year JEDEC maintained existing liaisons and developed new partnerships. Such collaboration is vital to the industry and helps avoid duplicative standards development efforts. Key activities include:
- CTA: JEDEC was an Allied Association for CES 2021.
- DLA: JEDEC continued its collaboration with the Defense Logistics Agency (DLA). The triad of JEDEC/SAE/DLA brings together the perspectives of the manufacturers, suppliers and government to update pertinent military standards including MIL-STD-750, MIL-STD-883, MIL-PRF-19500, MIL-PRF-38534, and MIL-PRF-38535.
- ECIA: JEDEC and ECIA are re-defining the next revision J-STD-002F Solderability for a 2021 joint task group effort.
- ESDA: JEDEC and ESDA have several ongoing collaborative projects related to ESD.
- IEC: Introduced MOUs for requirements, tests and data schemas for harmonization/driving of JEDEC standards into IEC.
- IPC: JEDEC and IPC continued their longstanding collaboration on standards for quality and reliability, including: Pb-Free wave solder (ECIA/IPC), Acoustic Microscopy J-STD-035, completed work on IPC/JEDEC 9301 for Numeric Simulation, and continued work on updates to J-STD-020.
- JEITA: JEDEC and JEITA held a virtual joint meeting September 2021 to continue their standards harmonization efforts.
- MIPI® Alliance: JEDEC’s Universal Flash Storage standard aligns with industry–leading specifications from the MIPI Alliance to form its Interconnect Layer. This collaboration continued with UFS version 3.1, which references the MIPI M-PHY® v4.1 physical layer specification and the MIPI UniProSM v1.8 transport layer specification.
- PCI-SIG: PCI-SIG and JEDEC have an MOU in place to facilitate work on a JEDEC Automotive SSD standard.
- SAE: JEDEC’s JC-13 Committee and SAE’s CE-11 and CE-12 Committees continued their longstanding collaboration on updating pertinent military standards.