Global Standards for the Microelectronics Industry
Year in Review: 2020
Thousands of dedicated volunteers representing nearly 300 member companies helped JEDEC serve the industry in 2020, and contributed to a year filled with both new and ongoing initiatives.
Standards and Publications
JEDEC continues to develop important new industry standards and publications in the areas of memory, packaging, quality and reliability, thermal standardization, electronic sensitivity and electrical interface. In 2020, JEDEC published 20 complete standards, 3 publications, 2 joint standards, 10 registration outlines, 1 design guide/registration, and 8 memory device specifications and Memory Module Design File Registrations, including the following:
- JESD79-5: DDR5 SDRAM
- PS-004A: UFS Socket Performance Standard
- JEP181: ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements
JEDEC’s newest main committee, JC-70 Committee on Wide Bandgap Power Electronic Conversion Semiconductors, published its second document:
- JEP180: Guideline for Switching Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices
JEDEC also published the following notable standards updates:
- JESD245D: Byte Addressable Energy Backed Interface
- JESD22-A105D: Power and Temperature Cycling
- JESD79-4: DDR4 SDRAM
- JESD220E: Universal Flash Storage (UFS), version 3.1
In addition, JEDEC package outlines now include 3D files (STP) with the drawings providing an electronic package design that can be inserted into end user documentation for package development.
2020 saw a steady increase in the number of new Chinese members joining, bringing the total number of member companies based in mainland China from 30 to a historical high of 39, accounting for 12.5% of the total JEDEC membership. Additional growth in membership is expected to continue over the next five years due to China’s investment in a its semiconductor industry and increased demand for new semiconductor devices in a rapidly interconnected world. The JC-14 China TG held its first meeting in 2020 in October.
During the past year JEDEC maintained existing liaisons and developed new partnerships. Such collaboration is vital to the industry and helps avoid duplicative standards development efforts. Key activities include:
- CTA: JEDEC was an Allied Association for CES 2020.
- DLA: JEDEC continued its collaboration with the Defense Logistics Agency (DLA). The triad of JEDEC/SAE/DLA brings together the perspectives of the manufacturers, suppliers and government to update pertinent military standards including MIL-STD-750, MIL-STD-883, MIL-PRF-19500, MIL-PRF-38534, and MIL-PRF-38535.
- ECIA: JEDEC and ECIA are re-defining the next revision J-STD-002F Solderability for a 2021 joint task group effort.
- ESDA: JEDEC and ESDA have several ongoing collaborative projects related to ESD, including: revisions of both JS-002 on CDM, JESD625 CDM user guide/harmonization and JEP157 ESD-CDM targets and JEPxxx Withstand Level reporting.
- IEC: Introduced MOUs for requirements, tests and data schemas for harmonization/driving of JEDEC standards into IEC. Introduced JESD47 for IEC to fill a gap for requirements, while coordinating with LSI qual. activity and power device testing standards.
- IPC: JEDEC and IPC continued their longstanding collaboration on standards for quality and reliability, including: Pb-Free wave solder (ECIA/IPC), Acoustic Microscopy J-STD-035, completed work on IPC/JEDEC 9301 for Numeric Simulation, and continued work on updates to J-STD-020. IPC is also involved in updating the scope for J-STD-002F Solderability.
- JEITA: JEDEC and JEITA held a virtual joint meeting September 2020 to continue their standards harmonization efforts.
- MIPI® Alliance: JEDEC’s Universal Flash Storage standard aligns with industry–leading specifications from the MIPI Alliance to form its Interconnect Layer. This collaboration continued with UFS version 3.1, which references the MIPI M-PHY® v4.1 physical layer specification and the MIPI UniProSM v1.8 transport layer specification.
- PCI-SIG: PCI-SIG and JEDEC entered into an MOU to facilitate work on a JEDEC Automotive SSD standard.
- SAE: JEDEC’s JC-13 Committee and SAE’s CE-11 and CE-12 Committees continued their longstanding collaboration on updating pertinent military standards.