Year in Review: 2019

Thousands of dedicated volunteers representing nearly 300 member companies helped JEDEC serve the industry in 2019, and contributed to a year filled with both new and ongoing initiatives.

Standards and Publications

JEDEC continues to develop important new industry standards and publications in the areas of memory, packaging, quality and reliability, thermal standardization, electronic sensitivity and electrical interface. In 2019, JEDEC published 15 complete standards, 5 publications, 2 joint standards, 11 registration outlines, 3 design guides/registrations, and 10 memory device specifications and Memory Module Design File Registrations, including the following:

  • JESD209-5, Low Power Double Data Rate 5 (LPDDR5) - publication pending
  • JESD8-33, 0.5 V Low Voltage Swing Terminated Logic (LVSTL05)

The newly formed JC-70 Committee on Wide Bandgap Power Electronic Conversion Semiconductors published its first document:

  • JEP173, Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices

Notably, new package outlines now include 3D files (STP) with the drawings providing an electronic package design that can be inserted into end user documentation for package development. To date, 5 outlines available include the 3D files: MO-332, MO-336, MO-338, MO-339, and MO-340.

JEDEC also published the following notable standards updates:

  • JESD30I, Descriptive Designation System for Electronic-Device Packages
  • JESD230D, NAND Flash Interface Interoperability
China

2019 saw a steady increase in the number of new Chinese members joining JEDEC, bringing the total number of member companies from mainland China to a historical high of 30. It is anticipated that further growth in membership will continue in the coming years due to continued expansion of China’s semiconductor and ICT, automotive as well as other related industries.

The JC-14 China TG which held three meetings in 2019 with participation by over 40 representatives from member and non-member companies.  The TG serves as a forum for technical exchange and discussion of JEDEC standards, and liaises with the JC-14 Committee for Quality & Reliability through mutual members.

Events

In May JEDEC hosted Mobile & IOT and Server Forums in partnership with KSIA (Korea Semiconductor Industry Association) and TSIA (Taiwan Semiconductor Industry Association) in Asia.  In October JEDEC held the following workshops in Santa Clara, CA and Hsinchu, Taiwan (in partnership with TSIA): LPDDR5, DDR5, NVDIMM-P as well as a Memory Tutorial.  An Automotive Forum was held in November in Munich, Germany, and the 34th annual Reliability of Compound Semiconductors (ROCS) Workshop was held in April.

Industry Collaboration

During the past year JEDEC maintained existing liaisons and developed new partnerships. Such collaboration is vital to the industry and helps avoid duplicative standards development efforts.  Key activities include:

  • CTA: JEDEC was an Allied Association for CES 2019.
  • DLA: JEDEC continued its collaboration with the Defense Logistics Agency (DLA). The triad of JEDEC/SAE/DLA brings together the perspectives of the manufacturers, suppliers and government to update pertinent military standards including MIL-STD-750, MIL-STD-883, MIL-PRF-19500, MIL-PRF-38534, and MIL-PRF-38535.
  • ECIA: JEDEC and ECIA are working on a revision to J-STD-002.
  • ESDA: JEDEC and ESDA have several collaborative projects related to ESD that are ongoing, including: revisions of both JS-001 on HBM ESD and JS-00 on CDM ESD, a C revision of JESD625, a white paper 5 on ESD Testing is in process, and work on harmonizing AEC Q-100 for ESD with JEDEC and ESDA. An ESD Workshop in China in October 2019 was jointly sponsored by JEDEC, JEITA and ESDA.
  • IPC: IPC/JEDEC 9703 and IPC/JEDEC-9706 were reaffirmed. New work on Rev F of J-STD-002 is in process, and IPC/JEDEC 9301 on Numerical Modeling is nearing publication. On J-STD-048, JEDEC has been working with IPC to add an annex that covers XML for this document.
  • JEITA: JEDEC and JEITA held a joint meeting in Sapporo in September 2019 to continue their standards harmonization efforts.
  • MIPI® Alliance: JEDEC’s Universal Flash Storage standard aligns with industry–leading specifications from the MIPI Alliance to form its Interconnect Layer. This collaboration continued with UFS version 3.0, which references the MIPI M-PHY® v4.1 physical layer specification and the MIPI UniProSM v1.8 transport layer specification.
  • SAE: JEDEC’s JC-13 Committee and SAE’s CE-11 and CE-12 Committees continued their longstanding collaboration on updating pertinent military standards.