Year in Review: 2018

Thousands of dedicated volunteers representing nearly 300 member companies helped JEDEC serve the industry in 2018, and contributed to a year filled with both new and ongoing initiatives.

Standards and Publications

JEDEC continues to develop important new industry standards and publications in the areas of memory, packaging, quality and reliability, thermal standardization, electronic sensitivity and electrical interface.  In 2018, JEDEC published 19 complete standards, 18 publications, 2 joint standards, 12 registration outlines, 3 design guides/registrations, 15 memory device specifications and Memory Module Design File Registrations, including the following:

  • JESD8-31, 1.8 V High-Speed LVCMOS (HS_LVCMOS) Interface
  • JESD22-B119, Mechanical Compressive Stress Test
  • JESD251, Expanded Serial Peripheral Interface (xSPI) For Non-volatile Memory Devices
  • JEP30, Part Model Guidelines for Electronic-Device Packages – XML Requirements
  • JEP30-A100, Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements, and JEP30-A101X, Part Model Assembly Process Classification Schema
  • JEP30-E101, Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements, and JEP30-E101X, Part Model Electrical Schema
  • JEP30-P100, Part Model Package Guidelines for Electronic-Device Packages – XML Requirements, and JEP30-P101X, Part Model Package Schema
  • JEP30-T100, Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements, and JEP30-T101X, Part Model Thermal Schema
  • JEP176, Adapter Test Board Reliability

JEDEC also published the following notable standards updates:

  • JESD216D, Serial Flash Discoverable Parameters (SFDP)

Owing to the continued development of China’s semiconductor industry and JEDEC's increasing influence in the market, 2018 saw a moderate but steady increase of new Chinese members joining JEDEC, bringing the total number of members from mainland China to a historical high of 23. It is anticipated that further growth in membership will continue in the coming years. 

JEDEC continued outreach efforts in China, which included ongoing support for local interest groups and participation in key industry events such as the 15th IEEE Conference on Wide Bandgap Power Devices and Applications (WiPDA Asia 2018); the 2nd China Electronic and Information Industry Intellectual Property Summit Forum; China Flash Memory Summit and the CESI Annual for ICT Standardization. 

The JC-14 China TG held three meetings  in 2018 with participation by over 40 representatives from member and non-member companies. The group now serves as a pertinent forum for technical exchange and discussion of JEDEC standards and liaises with the JC-14 committee through mutual members.


In March 2018 JEDEC hosted an education series including tutorials on Memory Systems and Memory Modules, Configurations and New SPD Architecture as well as a Mobile & IOT Forum.  An Automotive Forum was held in April in the Bay Area, and the 33rd annual Reliability of Compound Semiconductors (ROCS) Workshop was held in May.

Industry Collaboration

During the past year JEDEC maintained existing liaisons and developed new partnerships. Such collaboration is vital to the industry and helps avoid duplicative standards development efforts. Key activities include:

  • CTA: JEDEC was an Allied Association for CES 2018.
  • DLA: JEDEC continued its collaboration with the Defense Logistics Agency (DLA). The triad of JEDEC/SAE/DLA brings together the perspectives of the manufacturers, suppliers and government to update pertinent military standards including MIL-STD-750, MIL-STD-883, MIL-PRF-19500, MIL-PRF-38534, and MIL-PRF-38535.
  • ECIA: JEDEC and ECIA have completed a revision A of J-STD-075 Classification of Non IC Electronic Components for Assembly Processes. This was published in September 2018. Joint work on JS-709-C Defining Low Halogen was completed and this was published in March 2018.
  • ESDA: A minor revision to JS-001 on HBM ESD was balloted and was published last year that includes advanced sampling and waveform qualification. The user guide is being updated in 2018. For CDM ESD, a a revision is expected to be published in November. Work on harmonizing JESD625 Guidelines for Handling ESD Sensitive Devices and ESDA S20.20 has continued in 2018. An ESD Workshop in China in November 2018 was jointly sponsored by JEDEC and ESDA.
  • IPC: JEDEC completed its collaboration with IPC on Revision D of J-STD-033, which was published in May. J-STD-002 Rev E Solderability was completed and published in February 2018. New work on Rev F of J-STD-002 began in the fall. IPC/JEDEC 9301 on Numerical Modeling has been approved.
  • JEITA: JEDEC and JEITA held a joint meeting in Chicago in September 2018 to continue their standards harmonization efforts.
  • MIPI® Alliance: JEDEC’s Universal Flash Storage standard aligns with industry–leading specifications from the MIPI Alliance to form its Interconnect Layer. This collaboration continued with UFS version 3.0, which references the MIPI M-PHY® v4.1 physical layer specification and the MIPI UniProSM v1.8 transport layer specification.
  • SAE: JEDEC’s JC-13 Committee and SAE’s CE-11 and CE-12 Committees continued their longstanding collaboration on updating pertinent military standards.
Marketing and Communications

The Marketing and Communications Department was active this year in the promotion of JEDEC’s events and major standards announcements, resulting in prominent coverage in major industry publications.

JEDEC continued its longstanding partnership with SmartBrief to ensure the continued popularity of the JEDEC SmartBrief daily email newsletter, providing increased awareness for the JEDEC brand, standards and ongoing activities. Subscribe today.  In support of JEDEC flash memory standards and the new JC-70 committee, JEDEC was a sponsor of the Flash Memory Summit in August, and the WiPDA conference in October, respectively.