Global Standards for the Microelectronics Industry
Mobile Platform Memory Module Thermal Sensor Component Specification
Published: May 2022
Release No. 16.
This replaces Release 15 and includes the following editorial changes: 1) Replaced master/slave with controller/target 2) Checked for presence of other sensitive words 3) Added Tables and Figures in Table of Contents
(Release 15, Item 1640.07)
JESD21-C Solid State Memory Documents Main Page
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