Mobile Platform Memory Module Thermal Sensor Component Specification


Published: May 2022

Release No. 16.

This replaces Release 15 and includes the following editorial changes: 1) Replaced master/slave with controller/target 2) Checked for presence of other sensitive words 3) Added Tables and Figures in Table of Contents

(Release 15, Item 1640.07)

Committee(s): JC-42.4

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