Global Standards for the Microelectronics Industry
SILICON BOTTOM GRID ARRAY COLUMN, 0.035 MM X 0.055 MM PITCH RECTANGULAR PACKAGE (HBM4)
MO-362B
Published: Apr 2025
Designator: SBGA-M8236[56028]_I0p65-R14p175x10p975Z0p81
Item #: 4-1079
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Committee(s): JC-11
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