Global Standards for the Microelectronics Industry
Package-on-Package (PoP) and Internal Stacked Module (ISM)
MCP3.12.2
Published: Jan 2012
Release No. 22.
Item 48.18, 48.24, 48.26, 38.21b, 48.06a, 38.26, 48.28, 48.29
Committee(s): JC-63
JESD21-C Solid State Memory Documents Main Page
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