Multichip Packages (MCP) and Discrete eMMC, e2MMC, and UFS

MCP3.12.1

Published: Jan 2016

Item 133.03

This Section provides electrical interface items related to Multi-Chip Packages (MCP) and Stacked-Chip Scale Packages (SCSP) of mixed memory technologies including Flash (NOR and NAND), SRAM, PSRAM, LPDRAM, USF. etc. These items include die-on-die stacking within a single encapsulated package, package-on-package or module-in-package technologies, etc. The Section also contains Silicon Pad Sequence information for the various memory technologies to aid in the design and electrical optimization of the memory sub-system or complete memory stacked solution.

Committee(s): JC-64.2

Free download. Registration or required.