OVERVIEW OF METHODOLOGIES FOR THE THERMAL MEASUREMENT OF SINGLE- AND MULTI-CHIP, SINGLE- AND MULTI-PN-JUNCTION LIGHT-EMITTING DIODES (LEDS)

JESD51-50A

This document provides an overview of the methodology necessary for making meaningful thermal measurements on high-power light-emitting diodes (LEDs) built on single or multiple chips with one or more pn-junctions per chip. The actual methodology components are contained in separate detailed documents.

Committee(s): JC-15

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