THERMAL TEST CHIP GUIDELINE (WIRE BOND AND FLIP CHIP)

JESD51-4A

Published: Jul 2019

The purpose of this document is to provide a design guideline for thermal test chips used for integrated circuit (IC) and transistor package thermal characterization and investigations. The intent of this guideline is to minimize the differences in data gathered due to nonstandard test chips and to provide a well-defined reference for thermal investigations.

Committee(s): JC-15

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