Global Standards for the Microelectronics Industry
GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION
JESD51-12.01
Published: Nov 2012
This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between electronic package thermal information suppliers and users.
Committee(s): JC-15, JC-15.1
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