Global Standards for the Microelectronics Industry
Part Model Guidelines for Electronic-Device Packages – XML Requirements
Published: Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure.
For more information visit the main JEP30 webpage.
Committee(s): JC-11, JC-11.2
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