Global Standards for the Microelectronics Industry
Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements
Published: Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model.
For more information visit the main JEP30 webpage.
Committee(s): JC-11, JC-11.2, JC-14.4
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