Guideline for Characterizing Solder Bump Electromigration Under Constant Current and Temperature Stress

JEP154A

Published: Mar 2024

This publication describes a method to test the electromigration susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages.

Committee(s): JC-14, JC-14.1

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