Global Standards for the Microelectronics Industry
wetting, solder
The formation of a relatively uniform, smooth, unbroken, and adherent film of solder to a basis metal. (Ref. IPC‑T‑50.)
References:
J-STD-002B, 2/03
The formation of a relatively uniform, smooth, unbroken, and adherent film of solder to a basis metal. (Ref. IPC‑T‑50.)
J-STD-002B, 2/03