Global Standards for the Microelectronics Industry
wedge bond; stitch bond
The adhesion or weld of a thin wire, usually aluminum, to a package bonding surface, usually a plated leadframe post or finger, using an ultrasonic wire-bonding process. The wedge bond includes the compressed (ultrasonically bonded) area of the wire and the underlying bonding surface. For bonding to an aluminum alloy die bond pad, there is no wedge bond-bond pad intermetallic because the two materials are of the same composition; the two materials are recrystallized together by the ultrasonic energy of the welding process.