Global Standards for the Microelectronics Industry
wafer-level package
A package whose size is generally equal to the size of the semiconductor device it contains and that is formed by processing on a complete wafer rather than on an individual device.
NOTE 1 Because of the wafer-level processing, the size of a wafer-level package may be defined by finer dimensions and tighter tolerances than those for a similar non-wafer-level package.
NOTE 2 The package size will change with changes in the size of the die.
References:
JESD30D, 7/06
