Global Standards for the Microelectronics Industry
Pb-free; lead-free
Relating to electrical and electronic assemblies and components in which the lead (Pb) level in any of the raw materials and the end product is less than or equal to 0.1% by weight and that also meet the Pb-free requirements/definitions adopted by the RoHS Directive 2002/95/EC.
NOTE The reliability or performance of an assembly or component may be adversely affected by some Pb-free attachment time-temperature profiles; therefore, a time-temperature profile must be selected that will successfully attach the assemblies or components without causing their maximum temperature ratings to be exceeded.
References:
JESD97, 5/04