Global Standards for the Microelectronics Industry
nonwetting, solder
The partial adherence of molten solder to a surface that it has contacted while leaving some basis metal exposed. (Ref. IPC‑T‑50.)
References:
J-STD-002B, 2/03
The partial adherence of molten solder to a surface that it has contacted while leaving some basis metal exposed. (Ref. IPC‑T‑50.)
J-STD-002B, 2/03