Global Standards for the Microelectronics Industry
Dictionary N
nonwetting, solder
The partial adherence of molten solder to a surface that it has contacted while leaving some basis metal exposed. (Ref. IPC‑T‑50.)
References:J-STD-002B, 2/03
normal distribution
A continuous, symmetrical, bell-shaped frequency distribution for variables data. When measurements have a normal distrbution, about 68.26% of all individuals lie within plus or minus one standard deviation unit of the mean; about 95.44% lie within plus or minus two standard deviation units of the mean; and about 99.73% of all individuals lie within plus or minus three standard deviation units of the mean.
References:EIA-557-A, 7/95
NOVRAM
Acronym for "nonvolatile random-access memory". See also "NVRAM".
References:JESD100-B, 12/99
NP
See "no pin".
References:NU
See "nonusable terminal".
References:NVRAM
Abbreviation for "nonvolatile random-access memory". See also "NOVRAM".
References:JESD100-B, 12/99
n‑channel charge-coupled device
A charge-coupled device fabricated so that the charges stored in the potential wells are electrons.
References:JESD99B, 5/07
n‑channel field-effect transistor
A field-effect transistor that has an n‑type conduction channel. (Ref. IEC 747‑8.)
References:JESD24, 7/85
JESD77-B, 2/00
n‑type semiconductor
An extrinsic semiconductor in which the conduction-electron density exceeds the mobile-hole density. (Ref. IEC 747‑1.)
References:JESD77-B, 2/00
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