Global Standards for the Microelectronics Industry
Dictionary I
I-test
A latch-up test that supplies positive and negative current pulses to the pin under test.
References:JESD78A, 2/06
i-type [intrinsic] semiconductor
A nearly pure and ideal semiconductor in which the electron and hole densities are nearly equal under conditions of thermal equilibrium. (Ref. IEC 747‑1.)
References:JESD77-B, 2/00
I/O
See "I/O (bidirectional) pins" and "input/output".
References:I/O (bidirectional) pin
A device pin that can be made to operate as an input or an output or in a high-impedance state.
References:JESD78A, 2/06
I2t
The product of the square of the rms current and the time for an on-state (or forward) nonrepetitive surge current not exceeding 10 ms in duration for a single discrete element.
References:JESD14, 11/86
IC
See "integrated circuit".
References:ID(n)
See "identification".
References:ideal straight line (of a linear analog-to-digital converter [digital-to-analog converter])
In the transfer diagram, a straight line between the specified points for the most positive (least negative) and most negative (least positive) nominal midstep [step] values.
NOTE The ideal straight line passes through all the points for nominal midstep [step] values.
References:JESD99B, 5/07
identification [ID(n)]
A group of output terminals nominally used to convey information about the configuration or other attributes of the device when plugged into a system. The function of these outputs is similar to those of the PD(n) terminals, but the latter often have different electrical interface characteristics.
References:JESD21-C, 1/97
IGBT
See "insulated-gate bipolar transistor".
References:IGFET
See "insulated-gate field-effect transistor".
References:ignore
To place a device in a chain into a "bypass" mode, meaning that no operations are performed on that device. This would be done if devices in a chain were to be selectively programmed, for example.
References:JESD32, 6/96
illuminance; illumination (Ev)
The density of the luminous flux incident on a surface, i.e., the luminous flux divided by the area of the illuminated surface.
References:JESD77-B, 2/00
imaginary part of the small-signal open-circuit output admittance, common-emitter [Im(hoe)]
The ac collector current divided by the out-of-phase (imaginary) component of the small-signal collector-emitter voltage with the base terminal open-circuited to the emitter for ac.
References:JESD10#, 9/81
imaginary part of the small-signal short-circuit input impedance, common-emitter [Im(hie)]
The out-of-phase (imaginary) component of the small-signal ac base-emitter voltage divided by the ac base current with the collector terminal short-circuited to the emitter terminal for ac.
References:JESD10#, 9/81
IMC
See “intermetallic compound”. References:IMPATT [impact avalanche and transit-time] diode; avalanche diode operating in the IMPATT mode
A semiconductor microwave diode that, when its junction is biased into avalanche, exhibits a negative resistance over a frequency range determined by the transit time of charge carriers through the depletion region.
References:JESD77-B, 2/00
impulse waveshape, standard
A waveform that has a defined virtual front time and a defined virtual time to half peak value.NOTE 1 Impulse waveshapes may be given for either voltage or current.
NOTE 2 Virtual front time is the time interval between the virtual origin and the instant when the extrapolated leading edge reaches its peak; the extrapolation is made through the 10% and 90% amplitude points for current and the 30% and 90% points for voltage.
NOTE 3 Virtual time to half-peak value is the time interval between the virtual origin and the instant when the amplitude of the trailing edge reaches 50%. This is expressed as a combined front time and time to half-peak value such as 8/20 µs or 10/1000 µs.
References: JESD77C, 10/09JESD210, 12/07
in-line module
A microelectronic assembly whose terminals consist of metal pad surfaces located on one or both sides of a circuit board designed for insertion into an edge connector.
References:JESD30D, 7/06
in-line package
A package having a single row or parallel rows of leads designed primarily for insertion (through-hole) mounting perpendicular to the seating plane.
NOTE The leads may emerge from a single side or from two parallel sides with the leads formed to produce parallel rows.
References:JESD30D, 7/06
