Dictionary F

fiducial mark

Synonym for "registration mark".

References:

JESD99B, 5/07

field failure

Any failure that occurs after the completion of all the manufacturer's documented procedures and technology-conformance testing.

References:

JEP121A, 10/06

field lifetime

The expected time a product will function or be needed in the field determined. References:

JESD94A, 7/08

field-effect transistor (FET)

A transistor in which the conduction is due entirely to the flow of majority carriers through a conduction channel controlled by an electric field arising from a voltage applied between the gate and the source.

NOTE For graphical symbols, see JESD77-B, 4.3.1.

References:

JESD24, 7/85
JESD77-B, 2/00

field-induced charging

A charging method using electrostatic induction.

References:

JESD22-C101C, 12/04

field-programmable gate array (FPGA)

A gate array integrated circuit that can be electrically programmed.

References:

JESD12-1B, 8/93
JESD99B, 5/07

field-programmable logic array (FPLA)

Synonym for "programmable logic array".

References:

JESD99B, 5/07

field-programmable logic sequencer (FPLS)

Synonym for "programmable logic sequencer".

References:

JESD99B, 5/07

field-programmable read-only memory

A read-only memory that, after being manufactured, can have the data content of each memory cell altered. (Ref. IEC 748‑2.)

References:

JESD100-B, 12/99

film (of a film integrated circuit)

A layer of solid material formed by any deposition process upon the substrate or upon other films deposited on the substrate.

References:

JESD99B, 5/07

film integrated circuit

See "integrated circuit, film".

References:

film microcircuit

Synonym for "integrated circuit, film".

References:

film technology, thick-

The technology with which electronic circuits or elements are formed by applying a liquid, solid, or paste coating through a screen or mask in a selective pattern onto a supporting material.

NOTE This technology also includes films deposited by any other means when the films so formed are five micrometers or greater in thickness.

References:

JESD99B, 5/07

film technology, thin-

The technology with which electronic circuits or elements are formed by vapor deposition, vacuum deposition, or sputtering of films onto a supporting material.

NOTE This technology also includes similar techniques when the films so formed are less than five micrometers in thickness.

References:

JESD99B, 5/07

film, plated

A film obtained through chemical and/or electrochemical deposition.

References:

JESD99B, 5/07

film, thick (of a film integrated circuit)

A film produced by a printing process, serigraphy, or other related techniques.

References:

JESD99B, 5/07

film, thin (of a film integrated circuit)

A film produced by an accretion process such as vapor-phase deposition or sputtering.

References:

JESD99B, 5/07

fin (on a package)

A fine feather-edge protrusion occurring at an edge.

References:

JESD27, 8/93

finite population analysis (FPA)

A special case of signature analysis where the signature occurs in a particular finite population of devices.

References:

JEP136, 7/99

firing

A process of thick-film formation whereby the screened film is subjected to a precisely controlled high-temperature condition that oxidizes and vaporizes organic binders and modifies the film microstructure to achieve desired properties, including adherence to the substrate.

References:

JESD99B, 5/07

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