Global Standards for the Microelectronics Industry
Dictionary C
C
See "output clock".
References:C-mode
See "acoustic data, C-mode".
References:C4D
See "conductivity-connected charge-coupled device".
References:C; c
See "collector terminal".
References:CA
See "column address".
References:cache memory
A special buffer storage, smaller and faster than main storage, that is used to hold a copy of data or instructions that have been obtained automatically from main storage and are likely to be needed soon by the processor. (Adapted from ANSI X3.172.)
NOTE It is placed between the CPU and main storage to make main storage look like fast memory.
References:JESD100-B, 12/99
CAM
See "content-addressable memory".
References:can package
Generally, a cylindrical package whose terminals exit from one end parallel to the axis of the package.
References:JESD30D, 7/06
capability
The natural variation of the process due to common causes.
References:EIA-557-A, 7/95
EIA-599-A, 6/98
capability analysis
The study of a process to determine the probability that the characteristics of its output will fall within a previously defined set of constraints.
References:JEP132, 7/98
capability index
A measure of the relationship between the specification limits and the capability. See EIA QB6, Guideline on the Use and Application of Cpk and The Use and Abuse of Cpk by Berton H. Gunter.
References:EIA-557-A, 7/95
card detect [CD(n)]
The two signals, CD1 and CD2, that provide for proper memory card insertion detection and are positioned at opposite ends of the connector to facilitate the detection process. The signals are connected to ground internally on the memory card; thus they will be forced low whenever a card is placed in a host socket. The host socket interface circuitry shall provide 10-kΩ pull-up resistors to VCC on each of these signal pins.
References:JESD21-C, 1/97
carrier
A pocket tape, tray, tube, or other fixture used to store and transport finished packaged components.
References:J-STD-033B#, 10/05
JESD22-B101A, 10/04
carrier, (charge) (in a semiconductor)
A mobile (i.e., free) conduction electron or mobile hole. (Ref. IEC 747‑1.)
References:JESD77-B, 2/00
CAS
See "column enable".
References:case
Synonym for "package".
References:case temperature (TC)
The temperature measured at a specified location on the case of a device.
References:JESD10, 9/81
JESD77-B, 2/00
case-to-ambient thermal resistance
See "thermal resistance, case-to-ambient".
References:catastrophic failure
A failure that has serious consequences for the failed device or other components associated with it in the circuit (e.g., input shorted to power supply or ground, power-supply-to-ground short circuit, destructive latch-up, etc.).
References:JEP134, 9/98
