Forgot Password
|
Site Login
Go to main content
Menu
®
Global Standards for the Microelectronics Industry
Main menu
Standards & Documents
Search Standards & Documents
Technology Focus Areas
Flash Memory: SSDs, UFS, e.MMC
Main Memory: DDR4 & DDR5 SDRAM
JEP30: Part Model Guidelines
Memory Module Design File Registrations
Mobile Memory: LPDDR, Wide I/O, Memory MCP
Registered Outlines: JEP95
Memory Configurations: JESD21-C
Lead-Free Manufacturing
ESD: Electrostatic Discharge
Type Registration, Data Sheets
ID Codes Order Form
ID Codes for Low Power Memories Order Form
Copyright Information
Document Translation
About JEDEC Standards
Committees
All Committees
JC-11: Mechanical Standardization
JC-13: Government Liaison
JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
JC-63: Multiple Chip Packages
JC-64: Embedded Memory Storage & Removable Memory Cards
JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
News
News
JEDEC Awards: 2018 Honorees
JEDEC Quality & Reliability Task Group in China
Media Kit
Events & Meetings
All Events & Meetings
JEDEC UFS & MIPI UniPro Webinar
ROCS Workshop (GaAs)
DDR4 Workshop: Presentations for Sale
ROCS Workshop Interest List
ROCS Workshop: Papers for Sale
Career Center
Find a Job
Post a Job
Join
Apply for Membership
Membership Benefits
Membership Dues & Details
About
Overview
Activities
JEDEC History
Pre-1960s
1960s
1970s
1980s
1990s
2000s
2010s
Member List
Board of Directors
Committee Chairs
Policies & Governance
Patent Policy
Contact
Staff
RSS Feeds
Year in Review: 2017
Login required
Members Area
Main menu
Standards & Documents
Search Standards & Documents
Technology Focus Areas
Flash Memory: SSDs, UFS, e.MMC
Main Memory: DDR4 & DDR5 SDRAM
JEP30: Part Model Guidelines
Memory Module Design File Registrations
Mobile Memory: LPDDR, Wide I/O, Memory MCP
Registered Outlines: JEP95
Memory Configurations: JESD21-C
Lead-Free Manufacturing
ESD: Electrostatic Discharge
Type Registration, Data Sheets
ID Codes Order Form
ID Codes for Low Power Memories Order Form
Copyright Information
Document Translation
About JEDEC Standards
Committees
All Committees
JC-11: Mechanical Standardization
JC-13: Government Liaison
JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
JC-63: Multiple Chip Packages
JC-64: Embedded Memory Storage & Removable Memory Cards
JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
News
News
JEDEC Awards: 2018 Honorees
JEDEC Quality & Reliability Task Group in China
Media Kit
Events & Meetings
All Events & Meetings
JEDEC UFS & MIPI UniPro Webinar
ROCS Workshop (GaAs)
DDR4 Workshop: Presentations for Sale
ROCS Workshop Interest List
ROCS Workshop: Papers for Sale
Career Center
Find a Job
Post a Job
Join
Apply for Membership
Membership Benefits
Membership Dues & Details
About
Overview
Activities
JEDEC History
Pre-1960s
1960s
1970s
1980s
1990s
2000s
2010s
Member List
Board of Directors
Committee Chairs
Policies & Governance
Patent Policy
Contact
Staff
RSS Feeds
Year in Review: 2017
Login required
Members Area
Memory Module Design File Registrations News
JEDEC Events: Memory Tutorials, Mobile/IOT & Automotive Forums
Feb 2018
JEDEC and SNIA Win Best of Show Award for NVDIMM-N Standard at Flash Memory Summit
Aug 2017
JEDEC Announces Task Group to Define High Temperature Flatness Requirements and Metrology for Connectors and PCB Footprints
Apr 2017
JEDEC DDR5 & NVDIMM-P Standards Under Development
Mar 2017
JEDEC Announces Support for NVDIMM Hybrid Memory Modules
May 2015
JEDEC to Standardize Hybrid Memory Modules
Feb 2011
Standards and Documents Assistance
Contact
Julie Carlson
, 703-624-9230