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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2023 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • Automotive Electronics Forum
    • JEDEC DDR5 Workshop: Recordings for Sale
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
    • Member List
    • Board of Directors
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    • Patent Policy
    • JEDEC History
      • Pre-1960s
      • 1960s
      • 1970s
      • 1980s
      • 1990s
      • 2000s
      • 2010s
    • Contact
    • RSS Feeds
    • JEDEC Staff
    • Website Help
    • Year in Review: 2022
  • Login required Members Area

Memory Module Design File Registrations News

JEDEC Board Presents 2023 Distinguished Executive Leadership Award to AMD CEO Dr. Lisa T. Su Aug 2023
JEDEC to Host In-Person Memory Forum and DDR5 Workshop Apr 2022
JEDEC Honors Dr. Howard Yang of Montage Technology with New Award Jan 2020
JEDEC to Hold Workshops for DDR5, LPDDR5 & NVDIMM-P Standards Sep 2019
JEDEC Events: Memory Tutorials, Mobile/IOT & Automotive Forums Feb 2018
JEDEC and SNIA Win Best of Show Award for NVDIMM-N Standard at Flash Memory Summit Aug 2017
JEDEC Announces Task Group to Define High Temperature Flatness Requirements and Metrology for Connectors and PCB Footprints Apr 2017
JEDEC DDR5 & NVDIMM-P Standards Under Development Mar 2017
JEDEC Announces Support for NVDIMM Hybrid Memory Modules May 2015
JEDEC to Standardize Hybrid Memory Modules Feb 2011

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