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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR SDRAM, HBM
      • Mobile Memory: LPDDR
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2025 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • Server/Cloud Computing/AI Forum Korea
    • Server/Coud Computing/AI Forum Taiwan
    • Save the Date: Automotive Forum Munich
    • JEDEC DDR5 Workshop: Recordings for Sale
  • Join
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      • 2000s
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JEP30: PartModel Guidelines News

Open Compute Project Foundation and JEDEC Drive Open Silicon Innovation Feb 2025
JEDEC Announces New Release of JEP30 Part Model Guidelines, Empowering Chiplet Integration May 2024
JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation Oct 2023
JEDEC Publishes Major Update to JEP30 PartModel Guidelines May 2023
JEDEC and Open Compute Project Foundation Form New Collaboration Jan 2023
JEDEC to Enable Standard 3D Models of Electronic Components Nov 2018

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