Global Standards for the Microelectronics Industry
Recently Published Documents
Title | Document # | Date | Details |
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ESDA/JEDEC JOINT STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TESTING – CHARGED DEVICE MODEL (CDM) – DEVICE LEVEL This standard establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this standard. This test method combines the main features of JEDEC JESD22-C101 and ANSI/ESD S5.3.1. |
JS-002-2022 | Jun 2023 | view |
GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID/MCM PRODUCTS This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid/MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing/evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests. |
JEP142 | May 2023 | view |
Guidelines for Particle Impact Noise Detection (PIND) Testing, Operator Training, and Certification This publication is a guideline to test facilities in their efforts to establish and maintain consistent particle impact noise detection (PIND) testing. |
JEP114A | May 2023 | view |
Statistical Process Control Systems This standard specifies the general requirements of a statistical process control (SPC) system. |
JESD557D | May 2023 | view |
Graphics Double Data Rate (GDDR6) SGRAM Standard This document defines the Graphics Double Data Rate 6 (GDDR6) Synchronous Graphics Random Access Memory (SGRAM) specification, including features, functionality, package, and pin assignments. The purpose of this Standard is to define the minimum set of requirements for 8 Gb through 16 Gb x16 dual channel GDDR6 SGRAM devices. System designs based on the required aspects of this standard will be supported by all GDDR6 SGRAM vendors providing compatible devices. Some aspects of the GDDR6 standard such as AC timings and capacitance values were not standardized. Some features are optional and therefore may vary among vendors. In all cases, vendor data sheets should be consulted for specifics. This document was created based on some aspects of the GDDR5 Standard (JESD212). |
JESD250D | May 2023 | view |
Guidelines for Supplier Performance Rating This publication establishes guidelines and provides examples by which customers can measure their suppliers based on mutually agreed upon objective criteria. |
JEP146B | May 2023 | view |
HYBRIDS/MCM This specification establishes the general requirements for hybrid microcircuits, RF/microwave hybrid microcircuits and MCMs (hereafter referred to as devices). Detailed performance requirements for a specific device are specified in the applicable device acquisition document. In the event of a conflict between this document and the device acquisition document, the device acquisition document will take precedence. |
JESD93A | May 2023 | view |
SPD5118 HUB and SERIAL PRESENCE DETECT DEVICE STANDARD This standard defines the specifications of interface parameters, signaling protocols, and features for DDR5 Serial Presence Detect EEPROM with Hub function (SPD5 Hub) and integrated Temperature Sensor (TS) as used for memory module applications. The Hub feature allows isolation of a local bus from a Controller host bus. The designation SPD5118 or generic term SPD5 Hub refers to the devices specified by this standard. |
JESD300-5B.01 | May 2023 | view |
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