Recently Published Documents

Designator:  XBNA-N#_I1p0_...

Item No:  14-229

This standard defines the labels that shall be applied to all CXL memory modules to fully describe the key attributes of the module. The label can be in the form of a stick-on label, silk screened onto the assembly, or marked using an alternate customer-readable format.

This standard defines the requirements for the device qualification package, which the supplier provides to the customer.

This document defines the LPDDR4 standard, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this specification is to define the minimum set of requirements for a JEDEC compliant 16 bit per channel SDRAM device with either one or two channels. LPDDR4 dual channel device density ranges from 2 Gb through 32 Gb and single channel density ranges from 1 Gb through 16 Gb.

Item 11-1051

Package Designator:  PDSO-G#_...

Item 11-1054

Package Designator: PQFP-N28_I4p0...

This standard applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes, and it describes the marking and labeling of their shipping containers to identify their 2nd  level terminal finish or material.

This standard defines the specifications of interface parameters, signaling protocols, and features for PMIC device as used for memory module applications. The designation PMIC5020 refers to the device specified by this document.

The purpose is to provide a standard for the PMIC5020 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

This document defines the standards for achieving Reliability certification and qualification of on-chip MIM Capacitors and MIS Trench Capacitors.

This standard defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features as reference for specific target implementations of CXL-attached memory modules.

This publication describes a method to test the electromigration susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages.

This document defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR5 Clock Driver (CKD) for re-driving the DCK for CUDIMM, CSODIMM and CAMM applications. The DDR5CKD01 Device ID is DID = 0x0531. (5 = DDR5,
3= Clock Driver, 1= rev 01)

Designator: N/A

Item #: 11.5-995

This standard defines the electrical and mechanical requirements for 288-pin, 1.1 V (VDD), Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM UDIMMs). These DDR5 Unbuffered DIMMs (UDIMMs) are intended for use as main memory when installed in Computers.

This standard defines the electrical and mechanical requirements for 262-pin, 1.1 V (VDD), Clocked Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM CSODIMMs). These DDR5 CSODIMMs are intended for use as main memory when installed in Computers, laptops and other systems.

Designator: PDSO_N#[#]_I#-R#x#Z#-CturET0p04

Item: 11-1044

Cross Reference: DR4.8, DR4.16, DR4.20

This standard specifies the mechanical and electrical characteristics of the XFM removable memory Device.

This test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount soldering operation.

This test method covers X-ray imaging for terrestrial applications on packaged devices.

The purpose of this standard is to describe Zoned Storage for UFS, which enables higher bandwidth, lower latency and to reduce write amplification.

In conjunction with JEP181A, for user support this file is the entire “XML Requirements Schema”.

This publication provides guidance to SiC product suppliers and related power electronic industries in their evaluation of bipolar degradation mechanism in SiC power devices.

This Manual sets forth the mission and requirements of JEDEC as an independent incorporated Association governed by a Board of Directors.