Recently Published Documents

This document provides stress procedures, general failure criteria and documentation guidelines such that the dv/dt robustness can be demonstrated, evaluated and documented. This document gives examples for test setups which can be used and the corresponding test conditions. Additionally, criteria are explained under which device manufacturers can select an appropriate test setup.

Terminology Update.This standard defines the dc and ac single-ended (data) and differential (clock) operating conditions, I/O impedance, and the termination and calibration scheme for 1.5 V Pseudo Open Drain I/Os. The 1.5 V Pseudo Open Drain interface, also known as POD15, is primarily used to communicate with GDDR4 and GDDR5 SGRAM devices. Item 135.01

Item 11-993Designator: PBGA-B#[#]_I0p73...

Designator: PBGA-B#[#]_I0p65...Item: 11.11-1024, Access STP Files for MO-246ICross Reference: N/A 

Item: 11.1006ADesignator: PBGA-B#[#}_I0p4...

This standard defines the DDR5 SDRAM Specification, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this Standard is to define the minimum set of requirements for JEDEC compliant 8 Gb through 32 Gb for x4, x8, and x16 DDR5 SDRAM devices. This standard was created based on the DDR4 standards (JESD79-4) and some aspects of the DDR, DDR2, DDR3, and LPDDR4 standards (JESD79, JESD79-2, JESD79-3, and JESD209-4). Item 1848.99M.

This publication examines the LTS requirements of wafers, dice, and packaged solid-state devices. The user should evaluate and choose the best practices to ensure their product will maintain as-received device integrity and minimize age- and storage-related degradation effects.

This document replaces all past versions, however JESD220E, January 2020 (V 3.1), is available for reference only. This standard specifies the characteristics of the UFS electrical interface and the memory device. Such characteristics include (among others) low power consumption, high data throughput, low electromagnetic interference and optimization for mass memory subsystem efficiency. The UFS electrical interface is based on an advanced differential interface by MIPI M-PHY specification which together with the MIPI UniPro specification forms the interconnect of the UFS interface.

This annex JESD308-U0-RCA, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Raw Card AAnnex defines the design detail of x8, 1 Package Rank DDR5 UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.13A

This annex JESD308-U4-RCE, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) with 4-bit ECC (EC4 SODIMM) Raw Card E Annex" defines the design detail of x8, 2 Package Ranks DDR5 ECC UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.12A

This annex JESD308-U0-RCC, “DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Raw Card C Annex” defines the design detail of x16, 1 Package Ranks DDR5 UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.08A

PDSO-G10_I1p)...Item 11.11-1005

Editorial, Terminology Update. This standard defines the dc and ac single-ended (data) and differential (clock) operating conditions, I/O impedance's, and the termination and calibration scheme for 1.35 V Pseudo Open Drain I/Os. The 1.35 V Pseudo Open Drain interface, also known as POD135, is primarily used to communicate with GDDR5 or GDDR5M SGRAM devices. Item 146.01B

The Serial Flash Discoverable Parameter (SFDP) standard provides a consistent method of describing the functional and feature capabilities of serial flash devices in a standard set of internal parameter tables. These parameter tables can be interrogated by host system software to enable adjustments needed to accommodate divergent features from multiple vendors. Any company may request a Function Specific ID by making a request to the JEDEC office at juliec@jedec.org. Please include “Function Specific ID Request, JESD216” in the email subject line. Item 1775.73. Editorial changes listed in Annex, from original publication of JESD216F (December 2021).

This annex JESD309-S0-RCC, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw CardC Annex defines the design detail of x16, 1 Package Ranks DDR5 SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard.

Terminology Update, see Annex. This standard defines JEDEC requirements for solid state drives. For each defined class of solid state drive, the standard defines the conditions of use and the corresponding endurance verification requirements. Although endurance is to be rated based upon the standard conditions of use for the class, the standard also sets out requirements for possible additional use conditions as agreed to between manufacturer and purchaser.  Revision A includes further information on SSD Capacity. Items 303.19, 303.20, 303.21, 303.22, 303.23, 303.26, 303.27, 303.28, and 303.32

The JEDEC Board of Directors is responsible for establishing appropriate committees to conduct its standardization activities. These committees are assigned either service or product responsibilities. It is a primary function of each committee to propose JEDEC Standards and to formulate policies, procedures, formats, and other documents that are then submitted to the Board of Directors for action or approval. This publication identifies the service and product committees established by the Board of Directors and defines their scopes.

Release No. 19.01. Item 1739.02E, Terminology update. 
This standard defines the specifications of interface parameters, signaling protocols, and features for Serial Presence Detect (SPD) EEPROMs as used for memory module applications.

Release No. 16.This replaces Release 15 and includes the following editorial changes: 1) Replaced master/slave with controller/target 2) Checked for presence of other sensitive words 3) Added Tables and Figures in Table of Contents(Release 15, Item 1640.07)

Release 26.01, Terminology update

This standard defines the specifications of interface parameters, signaling protocols, and features for Serial Presence Detect (SPD) EEPROM (EE) and Temperature Sensor (TS) as used for memory module applications.

This standard defines the specifications of interface parameters, signaling protocols, and features for fifth generation Temperature Sensor (TS5) as used for memory module applications. These device operate on I2C and I3C two-wire serial bus interface. The designation TS5111 and TS5110 refers to the device specified by this document. Item 401.01E. Minor editorial changes listed in Annex A.

External visual inspection is an examination of the external surfaces, construction, marking, and workmanship of a finished package or component. External visual is a noninvasive and nondestructive test. It is functional for qualification, quality monitoring, and lot acceptance.

This standard, JESD305-R4-RCF, DDR5 Registered Dual Inline Memory Module with 4-bit ECC (EC4 RDIMM) Raw Card F Annex, defines the design detail of x4, 1 Package Rank DDR5 RDIMM with 4-bit ECC. The common feature of DDR5 RDIMM, such as the connector pinout, can be found in the JESD305, DDR5 Load Reduced (LRDIMM) and Registered Dual Inline Memory Module (RDIMM) Common Standard. Item 2273.10.

This standard specifies the host and device interface for a DDR4 NVDIMM-N, which is a DIMM that achieves non-volatility by copying SDRAM contents into non-volatile memory (NVM) when host power is lost using an Energy Source managed by either the module or the host. This standard is used in conjunction with JESD248. Item 2233.54G