Global Standards for the Microelectronics Industry
JC-14 Quality and Reliability of Solid State Products
JC-14 is responsible for standardizing quality and reliability methodologies for solid state products used in commercial applications such as computers, automobiles, telecommunications equipment, etc. It also includes developing standards for board-level reliability of solid state products used in commercial equipment.
The committee is comprised of both suppliers and users and furnishes a forum where concerns of the industry for solid state device quality and reliability issues can be resolved. The committee maintains liaisons with other JEDEC committees whose tasks are related to quality and reliability issues. In addition, the committee coordinates activities with other standards organizations such as IPC, IEC, and JEITA to help develop industry and worldwide standardization.
Find JC-14’s complete scope in JM18: JEDEC Committee Scope Manual.
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|SPECIAL REQUIREMENTS FOR MAVERICK PRODUCT ELIMINATION AND OUTLIER MANAGEMENT||JESD50C||Jan 2018|
|ADAPTER TEST BOARD RELIABILITY TEST GUIDELINES||JEP176||Jan 2018|
|INFORMATION REQUIREMENTS FOR THE QUALIFICATION OF SILICON DEVICES||JESD69C||Nov 2017|
|STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS||JESD47J.01||Sep 2017|
|CONSTANT-TEMPERATURE AGING METHOD TO CHARACTERIZE COPPER INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING||JESD214.01||Aug 2017|
|STANDARD LOGNORMAL ANALYSIS OF UNCENSORED DATA, AND OF SINGLY RIGHT -CENSORED DATA UTILIZING THE PERSSON AND ROOTZEN METHOD:||JESD37A||Aug 2017|
|TEMPERATURE, BIAS, AND OPERATING LIFE||JESD22-A108F||Jul 2017|
|JOINT JEDEC/ESDA STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TEST - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL||JS-001-2017||May 2017|
|WIRE BOND SHEAR TEST||JESD22-B116B||May 2017|
|FAILURE-MECHANISM-DRIVEN RELIABILITY MONITORING||JESD659C||Apr 2017|