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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR SDRAM, HBM
      • Mobile Memory: LPDDR
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2025 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • Server/Cloud Computing/AI Forum Korea
    • Server/Coud Computing/AI Forum Taiwan
    • Save the Date: Automotive Forum Munich
    • JEDEC DDR5 Workshop: Recordings for Sale
  • Join
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  • About
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      • Pre-1960s
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      • 1970s
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    • Year in Review: 2024
  • Login required Members Area

News

JEDEC JC-14.7 Subcommittee Broadens Focus to Include Radio Frequency Technologies Jan 2024
JEDEC Publishes New CAMM2 Memory Module Standard Dec 2023
JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation Oct 2023
JEDEC Board Presents 2023 Distinguished Executive Leadership Award to AMD CEO Dr. Lisa T. Su Aug 2023
JEDEC Publishes New Standard to Support CXL Memory Module Implementation Aug 2023
JEDEC Publishes Major Update to JEP30 PartModel Guidelines May 2023
JEDEC Expands CAMM Standardization to include Two Key Memory Technologies Apr 2023
JEDEC Creates New Automotive Steering Subcommittee Mar 2023
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Series of Documents for Reliability and Testing of Silicon Carbide (SiC) MOSFETs Feb 2023
JEDEC and Open Compute Project Foundation Form New Collaboration Jan 2023

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News

  • News
  • JEDEC Awards: 2025 Honorees
  • JEDEC Awards: Distinguished Members Recognition
  • In Memoriam
  • JEDEC Quality & Reliability Task Group in China
  • Media Kit

Media Inquiries

Please direct all media inquiries to:

Emily Desjardins
703-907-7560
Email Emily

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