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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2023 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • Mobile/Client/AI Computing Forum Korea
    • Server/Coud Computing/Edge Forum Korea
    • Mobile/Client/AI Computing Forum Taiwan
    • Server/Cloud Computing/Edge Forum Taiwan
    • JEDEC DDR5 Workshop: Recordings for Sale
    • Automotive Electronics Forum: Save the Date
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
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      • Pre-1960s
      • 1960s
      • 1970s
      • 1980s
      • 1990s
      • 2000s
      • 2010s
    • Contact
    • RSS Feeds
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    • Website Help
    • Year in Review: 2022
  • Login required Members Area

News

JEDEC Wide Bandgap Power Semiconductor Committee Publishes New Test Method for Continuous-Switching Evaluation of GaN Power Conversion Devices Jan 2021
JEDEC Advances Universal Flash Storage (UFS) Removable Card Standard 3.0 Dec 2020
JEDEC Announces Publication of JEDEC Module Sideband Bus Oct 2020
JEDEC Publishes New DDR5 Standard for Advancing Next-Generation High Performance Computing Systems Jul 2020
JEDEC Announces Publication of a New Serial Presence Detect Device Mar 2020
JEDEC Wide Bandgap Power Semiconductor Committee Publishes Guideline for Switching Reliability Evaluation Procedures for GaN Devices Feb 2020
JEDEC Publishes Update to Universal Flash Storage (UFS) Standard Jan 2020
JEDEC Honors Dr. Howard Yang of Montage Technology with New Award Jan 2020
JEDEC Publishes Update to LPDDR5 Standard for Low Power Memory Devices Jan 2020
JEDEC Announces Publication of Serial Presence Detect Support and Module Labels Specifications to Support New Hybrid Memory (NVDIMM) Sep 2019

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News

  • News
  • JEDEC Awards: 2023 Honorees
  • JEDEC Awards: Distinguished Members Recognition
  • In Memoriam
  • JEDEC Quality & Reliability Task Group in China
  • Media Kit

Media Inquiries

Please direct all media inquiries to:

Emily Desjardins
703-907-7560
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