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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2022 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • JEDEC DDR5 Workshop: Presentations for Sale
  • Join
    • Apply for Membership
    • Membership Benefits
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  • About
    • Overview
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      • Pre-1960s
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    • Member List
    • Board of Directors
    • Committee Chairs
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    • Year in Review: 2022
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News

JEDEC Confers International Awards of Distinction to Two Senior CSIA Officials Apr 2007
JEDEC Announces New Area of Development in Standard Setting Apr 2007
JEDEC Elects HP Representative to Join Board of Directors Mar 2007
JEDEC Adopts DDR2 32b SO-DIMM Design Specification Feb 2007
JEDEC Adopts Definitions of EE1002 and E1002A Serial Presence Detect EEPROM Feb 2007
MultiMediaCard Association (MMCA) and the JEDEC Solid State Technology Association (JEDEC) Announce eMMC for Embedded Flash Memory Applications Dec 2006
JEDEC Position Statement on "Enhanced Performance Profiles" ("EPP") May 2006
JEDEC to Adopt FB-DIMM Specification May 2006
JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline May 2006
MultiMediaCard Association and JEDEC Collaborate on MMC Standardization Mar 2006

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News

  • News
  • JEDEC Awards: 2022 Honorees
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  • Media Kit

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