Forgot Password | Site Login
Go to main content
®

Global Standards for the Microelectronics Industry

Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2023 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • Mobile/Client/AI Computing Forum Korea
    • Server/Coud Computing/Edge Forum Korea
    • Mobile/Client/AI Computing Forum Taiwan
    • Server/Cloud Computing/Edge Forum Taiwan
    • JEDEC DDR5 Workshop: Recordings for Sale
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
    • Member List
    • Board of Directors
    • Committee Chairs
    • Industry Collaboration
    • Policies & Governance
    • Patent Policy
    • JEDEC History
      • Pre-1960s
      • 1960s
      • 1970s
      • 1980s
      • 1990s
      • 2000s
      • 2010s
    • Contact
    • RSS Feeds
    • JEDEC Staff
    • Website Help
    • Year in Review: 2022
  • Login required Members Area

Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2023 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • Mobile/Client/AI Computing Forum Korea
    • Server/Coud Computing/Edge Forum Korea
    • Mobile/Client/AI Computing Forum Taiwan
    • Server/Cloud Computing/Edge Forum Taiwan
    • JEDEC DDR5 Workshop: Recordings for Sale
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
    • Member List
    • Board of Directors
    • Committee Chairs
    • Industry Collaboration
    • Policies & Governance
    • Patent Policy
    • JEDEC History
      • Pre-1960s
      • 1960s
      • 1970s
      • 1980s
      • 1990s
      • 2000s
      • 2010s
    • Contact
    • RSS Feeds
    • JEDEC Staff
    • Website Help
    • Year in Review: 2022
  • Login required Members Area

News

JEDEC to Set Solid State Drive Standards in 2009 Nov 2008
IPC and JEDEC Announce International Conference Offering Solutions to Challenges Posed by Lead-Free Electronics Manufacturing Oct 2008
ESD Association and JEDEC Announce Collaboration on Standards Development for Unified Electrostatic Discharge Test Methods Oct 2008
JEDEC and MindShare Announce Partnership for JEDEC Standards Education Oct 2008
JEDEC Solid State Technology Association Announces 50th Anniversary Sep 2008
MultiMediaCard Association Merges with JEDEC Sep 2008
JEDEC Continues SSD Standardization Efforts Jul 2008
JEDEC Lowers the Power for DDR3, Releases SPD Spec Jun 2008
JEDEC and the Open NAND Flash Interface Workgroup Collaborate on NAND Standardization Defining a Next-Generation NAND Standard wtih Global Reach May 2008
JEDEC Announces Opening of China Office May 2008

Pages

  • « first
  • ‹ previous
  • …
  • 13
  • 14
  • 15
  • …
  • next ›
  • last »

RSS Feed for JEDEC News »

News

  • News
  • JEDEC Awards: 2023 Honorees
  • JEDEC Awards: Distinguished Members Recognition
  • In Memoriam
  • JEDEC Quality & Reliability Task Group in China
  • Media Kit

Media Inquiries

Please direct all media inquiries to:

Emily Desjardins
703-907-7560
Email Emily

News RSS Feed

Subscribe to the JEDEC News and Media Coverage RSS feed to be notified when new documents are uploaded.

  • News and Media Coverage RSS Feed
  • See all JEDEC RSS Feed Options
  • Terms & Conditions
  • Privacy Policy
  • Contact Us
  • Refund Policy
  • Website Help
  • Login

Copyright © 2023 JEDEC. All Rights Reserved.

User login