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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR SDRAM, HBM
      • Mobile Memory: LPDDR
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2025 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • Server/Cloud Computing/AI Forum Korea
    • Server/Coud Computing/AI Forum Taiwan
    • Save the Date: Automotive Forum Munich
    • JEDEC DDR5 Workshop: Recordings for Sale
  • Join
    • Apply for Membership
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    • Overview
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      • 2000s
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    • Year in Review: 2024
  • Login required Members Area

News

JEDEC’s JC-15 Committee Invites Industry Participation for Advancing Thermal Characterization Standards for Semiconductor Packages Jul 2024
JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel High-Performance Computing and AI Jul 2024
JEDEC Approaches Finalization of HBM4 Standard, Eyes Future Innovations Jul 2024
JEDEC® Announces Publication of Compute Express Link® (CXL®) Support Standards Jun 2024
JEDEC Announces New Release of JEP30 Part Model Guidelines, Empowering Chiplet Integration May 2024
JEDEC Updates JESD79-5C DDR5 SDRAM Standard: Elevating Performance and Security for Next-Gen Technologies Apr 2024
JEDEC Plans to Update Popular Standard for Low Power Memory Mar 2024
JEDEC Publishes GDDR7 Graphics Memory Standard Mar 2024
Intel CEO Pat Gelsinger Receives 2024 Distinguished Executive Leadership Award from JEDEC Board Feb 2024
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices Jan 2024

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News

  • News
  • JEDEC Awards: 2025 Honorees
  • JEDEC Awards: Distinguished Members Recognition
  • In Memoriam
  • JEDEC Quality & Reliability Task Group in China
  • Media Kit

Media Inquiries

Please direct all media inquiries to:

Emily Desjardins
703-907-7560
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