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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2020 Honorees
      • JEDEC Awards: Dr. Joo Sun Choi, Samsung Electronics
      • JEDEC Awards: Dr. Howard Yang, Montage
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • ROCS Workshop: Papers for Sale
  • Join
    • Apply for Membership
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      • Pre-1960s
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    • Member List
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    • Year in Review: 2020
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News

JEDEC Announces Task Group to Define High Temperature Flatness Requirements and Metrology for Connectors and PCB Footprints Apr 2017
JEDEC DDR5 & NVDIMM-P Standards Under Development Mar 2017
JEDEC Updates Standards for Low Power Memory Devices Mar 2017
JEDEC Announces Annual Serial Presence Detect Enhancements Aug 2016
JEDEC Launches Quality & Reliability Task Group in China; Invites Industry Participation Apr 2016
JEDEC Updates Universal Flash Storage (UFS) and Related Standards Apr 2016
JEDEC Publishes Universal Flash Storage (UFS) Removable Card Standard Mar 2016
New JEDEC Standard Sets Best Practices for Mitigating Counterfeit Electronic Parts Mar 2016
JEDEC Publishes Revision of International Standard for Semiconductor Device Package Components (JESD30G) Feb 2016
JEDEC Announces Publication of GDDR5X Graphics Memory Standard Jan 2016

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News

  • News
  • JEDEC Awards: 2020 Honorees
    • JEDEC Awards: Dr. Joo Sun Choi, Samsung Electronics
    • JEDEC Awards: Dr. Howard Yang, Montage
  • JEDEC Quality & Reliability Task Group in China
  • Media Kit

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