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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR SDRAM
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2024 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • Automotive Electronics Forum
    • JEDEC DDR5 Workshop: Recordings for Sale
  • Join
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    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
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      • Pre-1960s
      • 1960s
      • 1970s
      • 1980s
      • 1990s
      • 2000s
      • 2010s
    • Contact
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    • Year in Review: 2023
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News

JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents Sep 2024
JEDEC Publishes Essential Test Method to Address Switching Energy Loss in Wide Bandgap and Silicon Semiconductor Power Devices Sep 2024
JEDEC Releases New Standard for LPDDR5/5X Serial Presence Detect (SPD) Contents Aug 2024
Discover the Future of Automotive Electronics: Join JEDEC’s Forum in San Jose on September 19th Aug 2024
JEDEC’s JC-15 Committee Invites Industry Participation for Advancing Thermal Characterization Standards for Semiconductor Packages Jul 2024
JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel High-Performance Computing and AI Jul 2024
JEDEC Approaches Finalization of HBM4 Standard, Eyes Future Innovations Jul 2024
JEDEC® Announces Publication of Compute Express Link® (CXL®) Support Standards Jun 2024
JEDEC Announces New Release of JEP30 Part Model Guidelines, Empowering Chiplet Integration May 2024
JEDEC Updates JESD79-5C DDR5 SDRAM Standard: Elevating Performance and Security for Next-Gen Technologies Apr 2024

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News

  • News
  • JEDEC Awards: 2024 Honorees
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  • In Memoriam
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  • Media Kit

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Please direct all media inquiries to:

Emily Desjardins
703-907-7560
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