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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR SDRAM
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2024 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • LPDDR6 Workshop: Interest List Sign-up
    • Save the Dates: Server/Cloud Computing/AI Forums in Korea and Taiwan
    • Save the Date: Automotive Forum Munich
    • JEDEC DDR5 Workshop: Recordings for Sale
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
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      • Pre-1960s
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      • 1970s
      • 1980s
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      • 2000s
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    • Year in Review: 2024
  • Login required Members Area

News

JEDEC Announces Enhanced NAND Flash Interface Standard with Increased Speeds and Efficiency Nov 2024
JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard Oct 2024
JEDEC to Launch New Raw Card DIMM Designs with DDR5 Clock Drivers, Enhancing Client Computing Memory Performance and Stability at 6400 Mbps and Beyond Oct 2024
JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents Sep 2024
JEDEC Publishes Essential Test Method to Address Switching Energy Loss in Wide Bandgap and Silicon Semiconductor Power Devices Sep 2024
JEDEC Releases New Standard for LPDDR5/5X Serial Presence Detect (SPD) Contents Aug 2024
Discover the Future of Automotive Electronics: Join JEDEC’s Forum in San Jose on September 19th Aug 2024
JEDEC’s JC-15 Committee Invites Industry Participation for Advancing Thermal Characterization Standards for Semiconductor Packages Jul 2024
JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel High-Performance Computing and AI Jul 2024
JEDEC Approaches Finalization of HBM4 Standard, Eyes Future Innovations Jul 2024

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News

  • News
  • JEDEC Awards: 2024 Honorees
  • JEDEC Awards: Distinguished Members Recognition
  • In Memoriam
  • JEDEC Quality & Reliability Task Group in China
  • Media Kit

Media Inquiries

Please direct all media inquiries to:

Emily Desjardins
703-907-7560
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