JEDEC Announces Partner Programs at CES, January 8th 2009 in Las Vegas, Nevada

Industry Leaders to Speak on the Future of Flash Memory in Consumer Products and Lead-Free Electronics Assembly

Arlington, VA - December 2, 2008 - The JEDEC Solid State Technology Association (JEDEC) today announced its participation in the 2009 International Consumer Electronics Show (CES) in Las Vegas, Nevada, on January 8. CES, produced by the Consumer Electronics Association, is the preeminent showcase for the worldwide consumer electronics industry. JEDEC is the leading developer of standards for the microelectronics industry, which are essential to the advancement of consumer electronics technology. JEDEC will present two CES Partner Programs: The Future of Flash Memory in Consumer Products and a tutorial on Lead-Free Assembly Classification and Handling.

Flash Memory has countless applications across the mobile and PC markets, and JEDEC's session at CES is the place to hear about all of them from industry insiders. Speakers from Intel, Micron, Microsoft, Nokia, Qualcomm, Seagate and Samsung will lead discussions about the impact of NAND Flash on consumer products, as well as current and future applications for Solid State Drives, Universal Flash Storage, e-MMC embedded memory storage cards and more.

Successful implementation of Pb-free electronics assembly processes is an ongoing challenge for the industry. Proper classification, handling, shipping and use of moisture-sensitive components are critical for reliable products. JEDEC's course at CES, facilitated by Jack McCullen of Intel, addresses the impact of Pb-free assembly on moisture- sensitivity classification and provides background information on moisture/reflow effects. J-STD-020, J-STD-033 and J-STD-075, the leading industry specifications for detailing proper moisture/reflow sensitivity procedures and classification, will be reviewed in detail.

"Semiconductor products and their quality and reliability play a critical role in the development of consumer electronics. JEDEC is pleased to partner with CES to highlight two distinct areas of interest for manufacturers – how the future of flash memory will affect consumer products, and a tutorial on implementation of Pb-free electronics," said Mian Quddus, Chairman of the JEDEC Board of Directors. "The diverse nature of these two programs illustrates the breadth of JEDEC standardization activities."

About JEDEC at CES

January 8, 2009, 10:00AM in Las Vegas Convention Center, South Hall

Session Title: The Future of Flash Memory Products
With speakers from Intel, Micron, Microsoft, Nokia, Qualcomm, Seagate and Samsung

Session Title: Understanding Moisture/Reflow Sensitivity for IC Packages: Achieving Pb-free Assembly Classification and Handling
Instructor: Jack McCullen, Intel

About JEDEC

JEDEC is the leading developer of standards for the solid-state industry. Almost 3,300 participants, appointed by some 295 companies work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards that they generate are accepted throughout the world. All JEDEC standards are available online, at no charge. For more information, visit www.jedec.org.