Global Standards for the Microelectronics Industry
JEDEC and IPC Update Essential Component Assessment Standard, J-STD-020E
ARLINGTON, Va., USA – February 6, 2015 – JEDEC Solid State Technology Association and IPC — Association Connecting Electronics Industries® today announced the publication of an update to J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. This widely used joint standard is used to determine what moisture-sensitivity-level (MSL) classification should be so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. J-STD-020 covers components to be processed at higher temperatures for lead-free and lower temperature Sn-Pb assemblies. The latest revision, J-STD-020E, is available from the JEDEC website or IPC website.
In this revision, clarification was added in numerous areas to ensure consistency in scope and application. Namely, J-STD-020E enumerates references regarding J-STD-075 (process sensitive levels), JEDEC JESD-A113 (preconditioning/reflow) and JEDEC JEP160 (long term storage), and incorporates considerations for bare-die with polymer and non-IC package usage. Revision E also clarifies/updates Classification Temperature (Tc), package volume, dry weight characterization, and recording with suggested intervals during dry weight determination. Guidance on bake time is also provided in the case that bake test interruption is observed.
The development of J-STD-020E was spearheaded by JEDEC’s JC-14.1 Subcommittee for Reliability Test Methods for Packaged Devices and by the IPC Plastic Chip Carrier Cracking Task Group (B-10a), and was assessed by both JEDEC and IPC in the final stages before publication.
JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing nearly 300 member companies work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for free download from the JEDEC website. For more information, visit www.jedec.org.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,500 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C..; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Suzhou, Chengdu and Beijing, China.
Sandy Gentry, Communications Manager