IPC and JEDEC Help Industry Transition to Lead Free

Bannockburn, Ill. and Arlington, Va., USA, January 14, 2009 - Meeting the
requirements of RoHS (restriction of the use of certain hazardous substances in
electrical and electronic equipment) compliance and successfully implementing lead-
free electronics assembly processes is an ongoing challenge for the electronic
interconnect industry. To help companies work toward their compliance goals, IPC
and JEDEC present "Transitioning to Lead Free — Strategies for Implementation," a
three-day conference to be held March 3–5, 2009 in Santa Clara, Calif.

The event features a full-day technical conference on March 4. An outstanding
roster of industry experts will cover such topics as: supply chain communication for a
lead-free world, aerospace response to lead-free solder, lead-free implementation for
SON and QFN devices, mitigation of corrosion-induced tin whiskers, and more.

Flanking the technical conference are two days of half-day workshops on March
3 and 5. Workshop instructors will address lead-free soldering processes, lead-free
systems performance and reliability, lead-free reliability in packaging and assembly,
failure and root-cause analysis in lead-free electronics, managing lead-free transition
and SMT in a lead-free world.

"Lead-free has impacted almost everyone in the electronics industry, from
suppliers of components, boards and materials to manufacturers and users of
electronic products and equipment, including the military and medical industry," says
Jean Hebeisen, IPC director of professional development. "Anyone in process, quality,
manufacturing, design, purchasing, supply and management that wants to get a good
understanding of the lead-free transition and how to successfully implement needs to
attend this conference."

JEDEC President John Kelly added, "This joint conference provides a
comprehensive and up-to-date compendium of information on the transition to lead
free. As member-driven organizations, IPC and JEDEC believe it's imperative to offer
the industry real-world information on how companies are meeting the challenges of
implementation."

For more information on the conference or to register, contact Michelle
Michelotti, IPC professional development coordinator, at +1 847-597-2822 or
MichelleMichelotti@ipc.org.

About IPC

IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the
competitive excellence and financial success of its 2,700 member companies which represent
all facets of the electronics industry, including design, printed board manufacturing, electronics
assembly and test. As a member-driven organization and leading source for industry
standards, training, market research and public policy advocacy, IPC supports programs to
meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains
additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and
Shanghai and Shenzhen, China.

About JEDEC

JEDEC is the leading developer of standards for the solid-state industry. Almost 3,300
participants, appointed by some 295 companies work together in 50 JEDEC committees to
meet the needs of every segment of the industry, manufacturers and consumers alike. The
publications and standards that they generate are accepted throughout the world. All JEDEC
standards are available online, at no charge. For more information, visit www.jedec.org.