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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR SDRAM, HBM
      • Mobile Memory: LPDDR
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2025 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • Server/Cloud Computing/AI Forum Korea
    • Server/Coud Computing/AI Forum Taiwan
    • Save the Date: Automotive Forum Munich
    • JEDEC DDR5 Workshop: Recordings for Sale
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
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    • Industry Collaboration
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      • Pre-1960s
      • 1960s
      • 1970s
      • 1980s
      • 1990s
      • 2000s
      • 2010s
    • Contact
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    • Year in Review: 2024
  • Login required Members Area

News

Altera Receives JEDEC Technical Recognition Award Nov 2007
TSE 2002 Serial Presence Detect (SPD) with Thermal Sensor in Process Sep 2007
JEDEC to Standardize SSD Aug 2007
JEDEC Begins Work on Next-Generation Universal Storage Solution Specification for Mobile, Consumer and Desktop Applications Aug 2007
DDR2 SO-DIMM - Revision 2.3 Released Aug 2007
JEDEC Standardization Meeting – Munich, Germany Aug 2007
JEDEC Announces Participation at MemCon Event July 17-19 Jun 2007
Publication of JEDEC DDR3 SDRAM Standard Jun 2007
SO-009 Issue A Outline Published May 2007
JEDEC Confers International Awards of Distinction to Two Senior CSIA Officials Apr 2007

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News

  • News
  • JEDEC Awards: 2025 Honorees
  • JEDEC Awards: Distinguished Members Recognition
  • In Memoriam
  • JEDEC Quality & Reliability Task Group in China
  • Media Kit

Media Inquiries

Please direct all media inquiries to:

Emily Desjardins
703-907-7560
Email Emily

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