Forgot Password | Site Login
Go to main content
®

Global Standards for the Microelectronics Industry

Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2023 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • JEDEC DDR5 Workshop: Recordings for Sale
    • Save the Dates: Mobile/Client/AI Computing Forum
    • Save the Dates: Server/Cloud Computing/Edge Forum
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
    • Member List
    • Board of Directors
    • Committee Chairs
    • Industry Collaboration
    • Policies & Governance
    • Patent Policy
    • JEDEC History
      • Pre-1960s
      • 1960s
      • 1970s
      • 1980s
      • 1990s
      • 2000s
      • 2010s
    • Contact
    • RSS Feeds
    • JEDEC Staff
    • Website Help
    • Year in Review: 2022
  • Login required Members Area

Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2023 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • JEDEC DDR5 Workshop: Recordings for Sale
    • Save the Dates: Mobile/Client/AI Computing Forum
    • Save the Dates: Server/Cloud Computing/Edge Forum
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
    • Member List
    • Board of Directors
    • Committee Chairs
    • Industry Collaboration
    • Policies & Governance
    • Patent Policy
    • JEDEC History
      • Pre-1960s
      • 1960s
      • 1970s
      • 1980s
      • 1990s
      • 2000s
      • 2010s
    • Contact
    • RSS Feeds
    • JEDEC Staff
    • Website Help
    • Year in Review: 2022
  • Login required Members Area

News

JEDEC Creates New Automotive Steering Subcommittee Mar 2023
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Series of Documents for Reliability and Testing of Silicon Carbide (SiC) MOSFETs Feb 2023
JEDEC and Open Compute Project Foundation Form New Collaboration Jan 2023
JEDEC Publishes Automotive Solid State Drive (SSD) Device Standard Dec 2022
JEDEC Announces Publication of the SPD5118 Hub and Serial Presence Detect Device and the DDR5 SPD Contents Specifications Nov 2022
CXL Consortium and JEDEC Sign MOU Agreement to Advance DRAM and Persistent Memory Technology Aug 2022
JEDEC Updates Universal Flash Storage (UFS) and Supporting Memory Interface Standard Aug 2022
JEDEC to Host In-Person Memory Forum and DDR5 Workshop Apr 2022
JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard Jan 2022
JEDEC Recognizes Nantero’s Bill Gervasi with Award of Excellence Dec 2021

Pages

  • 1
  • 2
  • 3
  • …
  • next ›
  • last »

RSS Feed for JEDEC News »

News

  • News
  • JEDEC Awards: 2023 Honorees
  • JEDEC Awards: Distinguished Members Recognition
  • In Memoriam
  • JEDEC Quality & Reliability Task Group in China
  • Media Kit

Media Inquiries

Please direct all media inquiries to:

Emily Desjardins
703-907-7560
Email Emily

News RSS Feed

Subscribe to the JEDEC News and Media Coverage RSS feed to be notified when new documents are uploaded.

  • News and Media Coverage RSS Feed
  • See all JEDEC RSS Feed Options
  • Terms & Conditions
  • Privacy Policy
  • Contact Us
  • Refund Policy
  • Website Help
  • Login

Copyright © 2023 JEDEC. All Rights Reserved.

User login