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Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2022 Honorees
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • ROCS Workshop
    • Santa Clara Event Details
      • Server/Cloud Computing/ Edge Forum
      • Memory Tutorial: A DDR5 Workshop Companion
      • DDR5 Workshop: Day 1 Agenda
      • DDR5 Workshop: Day 2 Agenda
  • Join
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    • Year in Review: 2021
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News

JEDEC to Host In-Person Memory Forum and DDR5 Workshop Apr 2022
JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard Jan 2022
JEDEC Recognizes Nantero’s Bill Gervasi with Award of Excellence Dec 2021
JEDEC Board Selects Samsung Memory Business President as Recipient of its 2022 Distinguished Executive Leadership Award Nov 2021
JEDEC Publishes Update to DDR5 SDRAM Standard Used in High-Performance Computing Applications Oct 2021
JEDEC Publishes XFM Embedded and Removable Memory Device Standard to Expand Storage Solutions in Embedded and Automotive Applications Aug 2021
JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications Jul 2021
SAE International and JEDEC Sign Standards Cooperation Agreement for Microelectronic Use in Aviation, Space and Defense Jul 2021
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Bias Temperature Instability of Silicon Carbide (SiC) MOS Devices Apr 2021
JEDEC Publishes DDR4 NVDIMM-P Bus Protocol Standard Feb 2021

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Emily Desjardins
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