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Year in Review: 2022
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Members Area
Main menu
Standards & Documents
Search Standards & Documents
Recently Published Documents
Technology Focus Areas
Main Memory: DDR4 & DDR5
Mobile Memory: LPDDR, Wide I/O
Flash Memory: SSDs, UFS, e.MMC, XFMD
Memory Configurations: JESD21-C
Memory Module Design File Registrations
Wide Bandgap Power Semiconductors: GaN, SiC
Registered Outlines: JEP95
JEP30: Part Model Guidelines
ESD: Electrostatic Discharge
Lead-Free Manufacturing
Type Registration, Data Sheets
Order JEDEC Standard Manufacturer's ID Code
Order ID Code for Low Power Memories
Copyright Information
Document Translation
About JEDEC Standards
Committees
All Committees
JC-11: Mechanical Standardization
JC-13: Government Liaison
JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
JC-63: Multiple Chip Packages
JC-64: Embedded Memory Storage & Removable Memory Cards
JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
News
News
JEDEC Awards: 2023 Honorees
JEDEC Awards: Distinguished Members Recognition
In Memoriam
JEDEC Quality & Reliability Task Group in China
Media Kit
Events & Meetings
All Events & Meetings
Mobile/Client/AI Computing Forum Korea
Server/Coud Computing/Edge Forum Korea
Mobile/Client/AI Computing Forum Taiwan
Server/Cloud Computing/Edge Forum Taiwan
JEDEC DDR5 Workshop: Recordings for Sale
Join
Apply for Membership
Membership Benefits
Membership Dues & Details
About
Overview
Member List
Board of Directors
Committee Chairs
Industry Collaboration
Policies & Governance
Patent Policy
JEDEC History
Pre-1960s
1960s
1970s
1980s
1990s
2000s
2010s
Contact
RSS Feeds
JEDEC Staff
Website Help
Year in Review: 2022
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Date(s):
5 Nov 2024
