Automotive Electronics Forum

Automotive-safe semiconductors have been in vehicles for a long time, and were previously used for important but lower-level functions like braking, drivetrain and cruise control. The latest chips being designed for Advanced Driver Awareness Systems (ADAS) and Autonomous Driving (AD) applications are very different, requiring a large amount of compute power and memory bandwidth, while remaining automotive safe. This presentation will discuss the fundamentals of creating an automotive safe chip, from aligning the organization to operate in a functionally safe way, to reasonable targets for ISO26262 and AEC Q100 automotive standards, and achieving success at functional safety audit.

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A modern Electric Vehicle (EV) is essentially a computer on wheels with a variety of complex compute domains that have a set of constraints unique to each domain. This talk looks explores the basic functionality of these compute domains and how the attributes of the memory subsystems vary with the workloads.

Next-generation automotive ecosystems present a difficult set of requirements for consideration by chipset developers. Dramatically higher computing requirements, operation at elevated temperatures and the migration to advanced process nodes all need evaluation. This session discusses these automotive ecosystem requirements and the effort to place non-volatile memory on the widely adopted JEDEC LPDDR interface to address this challenging environment

There is an exponential rise in compute needs in ADAS for Automoted driving as well as ECU Consolidation in MCU space for new Zonal EE architectures, which is driving a new generation of MCU and processors in Automotive space. This poses new demands on memory especially DRAM technology as well as flash (NAND/NOR). This presentation discusses technology trends for various ECU and density neeeds. The automotive market poses additional challenges related to cost and thermal aspects. The talk focuses on two of these challenges, namely thermal challenges with LPDDR4 and performance challenges with eXecuteInPlace (XIP) for NOR flash.

AS THE AUTOMOTIVE INDUSTRY transitions manufacturing from the cars with combustion engines to electric vehicles (EV), a dramatic increase in the requested power-on hours (POH) required for semiconductor ICs is also occurring.

The legacy reliability approach of using the Arrhenius equation and performing High Temperature Operating Life (HTOL) stress testing to match extended POH (> 20,000 POH) can give a false assurance of reliability.

A more analytic approach is to assess the application-specific use profile against the intrinsic reliability models of semiconductor wear-out mechanisms. This method is called the ZVEI Robustness Validation (RV) process and is described in appendix 7 of AEC-Q100 specification.

Coming soon

Driving Connectivity: Navigating the Roadmap of MIPI’s Automotive Solutions for Next-Gen Vehicles The presentation will provide a brief introduction to MIPI Alliance, history of MIPI’s liaison activities with JEDEC in support of UFS and Module Sideband Bus, and use of existing MIPI specifications in automotive products. It will provide an update on the latest development and status of MIPI Automotive SerDes Solutions (MASS), a full-stack automotive connectivity solution for integrating advanced image sensors and displays with end-to-end functional safety and security built in. It will lead in to the subsequent MIPI presentation - “Emerging Cybersecurity in Wired Connectivity Standards”.

This presentation will review the emerging requirements and developments of security in wired connectivity interfaces, with a focus on identifying a “checklist” for understanding the main features of a security framework. As a concrete example, we describe the ongoing work in MIPI Alliance to leverage the DMTF SPDM specification to secure the connectivity between automotive sensors and the central processing SoC for secured automated driving (ADAS/AD).

Starting from an introduction of Micron 30 years commitment to the automotive market and major milestones, the presentation will go through the Micron Foundations of Quality and the evolution from internal combustion engine to the electrical vehicles mission profiles and usage models.

Coming soon

Coming soon

This presentation covers architecture evolution for In-Vehicle Infotainment (IVI) and Advanced Driver Assist Systems (ADAS) systems that the Automotive Industry is undergoing to deliver the next level of experiences to drivers and passengers. It covers the Market trends driving this change and also focuses on technology enabling it.