Global Standards for the Microelectronics Industry
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Displaying 1 - 2 of 2 documents.
| Title | Document # | Date |
|---|---|---|
Compute Express Link (CXL™) Memory Module Base Standard |
JESD317 | Mar 2023 |
This standard defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features as reference for specific target implementations of CXL™-attached memory modules. The purpose is to provide certain reference base targets for CXL™-attached memory modules to enable system design simplification, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-45 Free download. Registration or login required. |
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Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-E100C | Nov 2023 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required. |
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