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STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS

 JESD47L Dec 2022

This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed.

Committee(s): JC-14, JC-14.3

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Wire Bond Pull Test Methods

 JESD22-B120.01 Sep 2024

This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. 

Committee(s): JC-14, JC-14.1

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