Global Standards for the Microelectronics Industry
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Wire Bond Pull Test Methods
This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices.
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed.
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