Global Standards for the Microelectronics Industry
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| Title | Document # | Date |
|---|---|---|
HIGH BANDWIDTH MEMORY (HBM) DRAM |
JESD235D | Mar 2021 |
The HBM DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM DRAM uses a wide-interface architecture to achieve high-speed, low-power operation. The HBM DRAM uses differential clock CK_t/CK_c. Commands are registered at the rising edge of CK_t, CK_c. Each channel interface maintains a 128b data bus operating at DDR data rates. Also available for designer ease of use is HBM Ballout Spreadsheet (Note this version is the latest version for use with JESD235D). Committee item 1797.99L. Committee(s): JC-42.3C Available for purchase: $247.00 Add to Cart Paying JEDEC Members may login for free access. |
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