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Title	Document #	Date
Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements	JEP30-T100A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. Committee(s): JC-11, JC-11.2, JC-15 Free download. Registration or login required.
PART MODEL THERMAL GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES – XML REQUIREMENTS	JEP30-T100	Mar 2018
JEP30-T100 has been superseded and is provided here for reference only. For more information, visit the JEP30 webpage.This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. Committee(s): JC-11.2 Free download. Registration or login required.