Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
Registration - Plastic Ultra-Thin Small Outline No-Lead Package 0.5mm Pitch. Item 11.11-498. |
MO-197-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Plastic Ultra-Thin Small Outline, No Lead Package. Item 11.11-508. |
MO-196-C | |
Committee(s): JC-11 Free download. Registration or login required. |
||
METHODS OF MEASUREMENT FOR SEMICONDUCTOR LOGIC GATING MICROCIRCUITS:Status: ReaffirmedFebruary 1984 |
JEB5-A | Jan 1970 |
The purpose of this bulletin is to recommend for use in the rating of semiconductor logic gating microcircuits which use the binary states to represent and process logic information. Both static and dynamic measurements are covered. Committee(s): JC-BOD Free download. Registration or login required. |
||
STANDARD FOR THE MEASUREMENT OF SMALL-SIGNAL TRANSISTOR SCATTERING PARAMETERS:Status: ReaffirmedApril 1999, March 2009 |
JESD435 | Apr 1976 |
This standard specifies the standard for the measurement of small-signal transistor scattering parameters. Formerly known as RS-435 and/or EIA-435 Committee(s): JC-25 Free download. Registration or login required. |
||
GLOSSARY OF MICROELECTRONIC TERMS, DEFINITIONS, AND SYMBOLS: ELEVATED TO JESD99, June 1985.Status: Rescinded |
JEP99 | Jul 1977 |
Committee(s): JC-10 Free download. Registration or login required. |
||
TERMS, DEFINTIONS, AND LETTER SYMBOLS FOR MICROCOMPUTERS AND MEMORY INTEGRATED CIRCUITS: ELEVATED TO JESD100, August 1993.Status: Rescinded |
JEP100 | Sep 1979 |
Committee(s): JC-10 Free download. Registration or login required. |
||
JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001Status: Rescinded |
JEP105 | Apr 1983 |
Committee(s): JC-13.5 Free download. Registration or login required. |
||
LETTER SYMBOLS USED WITH INFRARED DEVICES - INCORPORATED INTO JESD77-A.Status: Rescinded |
JEP75 | Aug 1984 |
Committee(s): JC-10 Free download. Registration or login required. |
||
TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF PARTICLE GETTERS FOR USE IN HYBRID MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001Status: Rescinded |
JEP107 | Apr 1985 |
Committee(s): JC-13.5 Free download. Registration or login required. |
||
STANDARD FOR DESCRIPTION OF 54/74HCXXXX AND 54/74HCTXXXX HIGH SPEED CMOS DEVICES: |
JESD7-A | Aug 1986 |
This standard provides uniformity, multiplicity of sources, eliminate confusion, and ease of device specification and design by users for HC, and HCT CMOS devices. This standard specifies electrical parameters. It also includes appendices listing part numbers. Committee(s): JC-40.2 Free download. Registration or login required. |
||
TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001Status: Rescinded |
JEP112 | Jun 1987 |
Committee(s): JC-13 Free download. Registration or login required. |
||
ADDENDUM No. 1 to JESD99, TERMS, DEFINITIONS, AND LETTER SYMBOLS FOR ANALOG-TO-DIGITAL AND DIGITAL-TO-ANALOG CONVERTERSStatus: Incorporated into JESD99-A, May 2000 |
JESD99-1 | Jul 1989 |
This addendum has now been incorporated into JESD99. Committee(s): JC-10 Free download. Registration or login required. |
||
Nibble Wide ECL SRAM |
SRAM3.7.4 | Dec 1994 |
Release No.04 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
GUIDELINE FOR MEASUREMENT OF ELECTRONIC PACKAGE INDUCTANCE AND CAPACITANCE MODEL PARAMETERS: |
JEP123 | Oct 1995 |
The need for this guideline arose from widespread lack of consistency in characterizing electrical parameters of electronic packages, which existed in the industry until the early 1990s. Then, the JEDEC Committee JC-15 provided the forum where various methods were discussed and commonality in approach emerged. The result is that today we have relatively consistent results in measuring and reporting electrical package parameters, as well as specialized tools (e.g., the IPA-510, the interconnect parameter analyzer) which were developed to support the methodology. Free download. Registration or login required. |
||
GUIDELINES FOR THE PACKING, HANDLING, AND REPACKING OF MOISTURE-SENSITIVE COMPONENTS - SUPERSEDED BY J-STD-033, May 1999.Status: RescindedNovember 1999 |
JEP124 | Dec 1995 |
Committee(s): JC-14.4 Free download. Registration or login required. |
||
INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD - ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE): |
JESD51- 1 | Dec 1995 |
The purpose of this test method is to define a standard Electrical Test Method (ETM) that can be used to determine the thermal characteristics of single integrated circuit devices housed in some form of electrical package. This method will provide a basis for comparison of different devices housed in the same electronic package or similar devices housed in different electronic packages. Committee(s): JC-15.1 Free download. Registration or login required. |
||
THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)- SUPERSEDED BY JESD51-4, September 1997.Status: ElevatedSeptember 1997 |
JEP129 | Feb 1997 |
Committee(s): JC-15.1 Free download. Registration or login required. |
||
MPDRAM Optional Features |
MPDRAM3.10.4 | Jun 1997 |
Release No.9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
One Byte Modules |
MODULE4.2 | Jun 1997 |
Release No. 9 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
Two Byte Modules Cards |
MODULE4.3 | Jun 1997 |
Release No.9 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
